Magnetron sputtering: Sputtering is a popular method of vacuum deposition to increase the properties and lifespan of tools and components, in which portions of materials are physically removed from the coating material called target. Under the high voltage acceleration in the evacuated chamber, the ion becomes in progress of constant bombardment with the target, until the ion, atom or molecule has been sputtered from the target and deposited onto the substrate, where they form a tight bond. Reactive gases can be introduced into the sputtering process. These gases react with the ions vaporized from the target forming a thin film of the required compound. This is known as the Reactive Magnetron Sputtering. This effective vapor phase technique can deposit just about any coating material, whether conductive or non-conductive with a large sputtering application range. With that, the magnetron sputtering technique has been successfully listed under the decorative vacuum coating and functional hard coating technologies.
   Magnetic enhanced cathodic arc: In the chamber of good vacuum or low pressure gas, low voltage and high current flow is used in melting the coating material, the target. Under these conditions, the target material changes into vapor state and is ionized as it passes through the plasma arc. The whole process completes as coating material deposits onto the substrate forming a thin film. Stararc provides the improved magnetic enhanced cathodic arc which has an effective control on the electric arc over the surface of the target, causing higher percentage of the ionization for better coating quality. The magnetic enhanced cathodic arc is a mature technology could be used on a wide range of cutting tools and moulds and wear-resistant or self-lubricate components .